Investments
| # | Organization | Project Name | Project Type | Location | Technology Partner | Investment | Capacity | Technology | Expected Employment | Products | Applications |
|---|---|---|---|---|---|---|---|---|---|---|---|
| 1 |  |
Micron Semiconductor Technology | ATMP | Sanand, Gujarat | In-house (USA) | ₹22,516 crore | 1,352 MN units per year | Flip-Chip and Wirebond. | ~ 20,000 jobs | DRAM components/modules, NAND components, SSDs | Mobile phones, laptop, servers, automobiles, other consumer electronics |
| 2 |  |
Tata Semiconductor Manufacturing | Semiconductor Fab | Dholera, Gujarat | PSMC (Taiwan) | ₹91,526 crore | 50,000 wafer starts per month (WSPM) | 12″ CMOS ranging from 28nm to 110nm. | ~ 20,000 jobs | PMIC, logic & display drivers | Mobile Phones, automobiles, consumer electronics,communications, display drivers for PCs, tablets, TVs, and commercial screens |
| 3 | |
Tata Semiconductor Assembly and Test | OSAT | Morigaon, Assam | In House (India) | ₹27,120 crore | 15,600 MN units per year | Wirebond, Flip-Chip, ISP | ~ 26,000 jobs | QFN, QFP, TSOP, TO, WB-BGA, FC BGA, SiP | Automotive, EVs, consumer electronics, telecom, mobile |
| 4 |  |
CG Power and Industrial Solutions | OSAT | Sanand, Gujarat | Renesas (Japan), and Stars Microelectronics (Thailand) | ₹7,584 crore | 4,044 MN units per year | Wirebond & Flip-Chip | ~ 5,000 jobs | QFN, QFP, BGA, FCBGA, FC CSP | Consumer electronics, industrial, automotive, power applications, etc. |
| 5 |  |
Kaynes Semicon | ATMP Project | Sanand, Gujarat | Globetronics, Malaysia & AOI (Japan) | ₹3,307 crore | 2,310 MN units per year | Wirebond, Flip-Chip, Photonics | ~ 2000 jobs | QFN, SOT-223, TO-220, BGA, stacked BGA, FCBGA, SiP, photonics | Power devices, communications, automotive, EV, computing, industrial |
| 6 |  |
India Chip (HCL-Foxconn JV) | OSAT (ADVANCE PACKAGING) | Yeida, Uttar Pradesh | Hon Hai Technology (Foxconn) (Taiwan) | ₹3,706 crore | 432 MN units per year | Wafer-Level Packaging (Au bump) | ~ 4000 jobs | Display Driver ICs (Wafer level packaging), Chip Probing Services, Die Processing Services (DPS) | Displays for Mobiles, Tablets, Automobile etc. |
| 7 |  |
Advanced System in Package Technologies | OSAT | Andhra Pradesh | APACT (South Korea) | ₹469 crore | 96 MN units per year | Wirebond & Flip-Chip | ~ 500 Jobs | QFN & FCBGA | Mobile phones & ICs for set top boxes, automobile applications & other electronic products. |
| 8 |  |
SICSEM | Compound fab and ATMP | Bhubaneswar, Odisha | Clas-SiC (UK) & CDIL (India) | ₹2,067 crore | 96 MN units per year | SiC MOSFET & Diode Fab & Packaging | ~ 1000 Jobs | Power MOSFETs & diodes | EVs, solar, space, defense, high-voltage. |
| 9 |  |
3D Glass | Advance Packaging | Bhubaneswar, Odisha | In-house (USA) | ₹1,944 crore | 120 MN units per year | Glass substrate ATMP & 3DHI modules | ~ 284 Jobs | FCBGA, ICS, RF SiP, AiP, glass interposers | HPC/AI compute, RF, automotive, sensors, quantum, bio-med |
| 10 |  |
Continental Device India | OSAT | Mohali, Punjab | In-house (India) | ₹118 crore | 158 MN units per year | Advanced SiC & high-power diode packages | ~ 250 Jobs | MOSFETS, IGBTs Schottky Bypass Diodes, Bipolar Junction Transistors (TO247, D2PAK, DPAK, Schottky diodes) | Automotive, Renewable Energy Systems , Consumer electronics, industrial. |