The Government of India supports semiconductor manufacturing through a comprehensive fiscal, infrastructure, design, and ecosystem-development framework, anchored under the Semicon India Programme and implemented by the India Semiconductor Mission (ISM).
The Scheme for setting up semiconductor and display manufacturing in India provides fiscal support of 50% of the project cost on a pari-passu basis to the approved applicants.
Many state policies share common incentive elements that complement Centre initiatives such as Semicon India, SPECS and Production Linked Incentive (PLI) schemes.
| # | Organization | Project Name | Project Type | Location | Technology Partner | Investment | Capacity | Technology | Expected Employment | Products | Applications |
|---|---|---|---|---|---|---|---|---|---|---|---|
| 1 |  |
Micron Semiconductor Technology | ATMP | Sanand, Gujarat | In-house (USA) | ₹22,516 crore | 1,352 MN units per year | Flip-Chip and Wirebond. | ~ 20,000 jobs | DRAM components/modules, NAND components, SSDs | Mobile phones, laptop, servers, automobiles, other consumer electronics |
| 2 |  |
Tata Semiconductor Manufacturing | Semiconductor Fab | Dholera, Gujarat | PSMC (Taiwan) | ₹91,526 crore | 50,000 wafer starts per month (WSPM) | 12″ CMOS ranging from 28nm to 110nm. | ~ 20,000 jobs | PMIC, logic & display drivers | Mobile Phones, automobiles, consumer electronics,communications, display drivers for PCs, tablets, TVs, and commercial screens |
| 3 | |
Tata Semiconductor Assembly and Test | OSAT | Morigaon, Assam | In House (India) | ₹27,120 crore | 15,600 MN units per year | Wirebond, Flip-Chip, ISP | ~ 26,000 jobs | QFN, QFP, TSOP, TO, WB-BGA, FC BGA, SiP | Automotive, EVs, consumer electronics, telecom, mobile |
| 4 |  |
CG Power and Industrial Solutions | OSAT | Sanand, Gujarat | Renesas (Japan), and Stars Microelectronics (Thailand) | ₹7,584 crore | 4,044 MN units per year | Wirebond & Flip-Chip | ~ 5,000 jobs | QFN, QFP, BGA, FCBGA, FC CSP | Consumer electronics, industrial, automotive, power applications, etc. |
| 5 |  |
Kaynes Semicon | ATMP Project | Sanand, Gujarat | Globetronics, Malaysia & AOI (Japan) | ₹3,307 crore | 2,310 MN units per year | Wirebond, Flip-Chip, Photonics | ~ 2000 jobs | QFN, SOT-223, TO-220, BGA, stacked BGA, FCBGA, SiP, photonics | Power devices, communications, automotive, EV, computing, industrial |
| 6 |  |
India Chip (HCL-Foxconn JV) | OSAT (ADVANCE PACKAGING) | Yeida, Uttar Pradesh | Hon Hai Technology (Foxconn) (Taiwan) | ₹3,706 crore | 432 MN units per year | Wafer-Level Packaging (Au bump) | ~ 4000 jobs | Display Driver ICs (Wafer level packaging), Chip Probing Services, Die Processing Services (DPS) | Displays for Mobiles, Tablets, Automobile etc. |
| 7 |  |
Advanced System in Package Technologies | OSAT | Andhra Pradesh | APACT (South Korea) | ₹469 crore | 96 MN units per year | Wirebond & Flip-Chip | ~ 500 Jobs | QFN & FCBGA | Mobile phones & ICs for set top boxes, automobile applications & other electronic products. |
| 8 |  |
SICSEM | Compound fab and ATMP | Bhubaneswar, Odisha | Clas-SiC (UK) & CDIL (India) | ₹2,067 crore | 96 MN units per year | SiC MOSFET & Diode Fab & Packaging | ~ 1000 Jobs | Power MOSFETs & diodes | EVs, solar, space, defense, high-voltage. |
| 9 |  |
3D Glass | Advance Packaging | Bhubaneswar, Odisha | In-house (USA) | ₹1,944 crore | 120 MN units per year | Glass substrate ATMP & 3DHI modules | ~ 284 Jobs | FCBGA, ICS, RF SiP, AiP, glass interposers | HPC/AI compute, RF, automotive, sensors, quantum, bio-med |
| 10 |  |
Continental Device India | OSAT | Mohali, Punjab | In-house (India) | ₹118 crore | 158 MN units per year | Advanced SiC & high-power diode packages | ~ 250 Jobs | MOSFETS, IGBTs Schottky Bypass Diodes, Bipolar Junction Transistors (TO247, D2PAK, DPAK, Schottky diodes) | Automotive, Renewable Energy Systems , Consumer electronics, industrial. |
| # | Organization | Project Name | Project Outlay (in Lakhs ₹) | Location |
|---|---|---|---|---|
| 1 | Fermionic Design Pvt. Ltd. | A 4-channel Mux-Demux Gain Phase Shifter for Hybrid Beamformer in 8-12GHz for satellite communication and 5G Antenna Array systems | 1047.19 | KARNATAKA |
| 2 | Morphing Machines Pvt. Ltd. | SoC, IP and Acclerator card powered by REDEFINE architecture and Ecosystem | 2048.83 | KARNATAKA |
| 3 | Calligo Technologies Pvt. Ltd. | SoC with RISC V and POSIT Coprocessor based Accelerator Card with Software Ecosystem | 4192.75 | KARNATAKA |
| 4 | Sensesemi Technologies Pvt. Ltd. | SenseSoC-200 SoC for IOT and Medical Applications | 3907.02 | KARNATAKA |
| 5 | Saankhya Labs Pvt. Ltd. | SoC for Baseband Processing for 5G Telecom infrastructure | 2558.77 | KARNATAKA |
| 6 | Aryabhata Circuits and Research Labs Pvt. Ltd. | Next Generation IC for Advanced Tire Monitoring System (TMS) | 4095.49 | KARNATAKA |
| 7 | BigEndian Semiconductors Pvt. Ltd. | SoC for Video Audio Surveillance Unit, Design and Development | 3108 | KARNATAKA |
| 8 | C2i Semiconductors Pvt. Ltd. | A Digital Multiphase Controller IC for Enterprise Server Power | 8375.2 | KARNATAKA |
| 9 | MMRFIC Technology Pvt. Ltd. | Indigenous Ka-Band Beamformer RADAR Chip | 1253.04 | KARNATAKA |
| 10 | Sophrosyne Technologies Pvt. Ltd. | High-precision, Ultra-low-power SoC for real-time monitoring of cardiac activity and other vital health parameters | 2147.1 | KARNATAKA |
| 11 | Aagyavision Pvt. Ltd. | Radar RF chips for edge applications | 2547.9 | KARNATAKA |
| 12 | Aheesa Digital Innovations Pvt. Ltd. | VEGA Processor based GPON ONT and Network SoC for FTTX and Broadband applications | 4140 | TAMIL NADU |
| 13 | Mindgrove Technologies Pvt. Ltd. | Vision SoC using Shakti processor for Edge Computing | 4786.11 | TAMIL NADU |
| 14 | InCore Semiconductors Pvt. Ltd. | RISC-V multi-core super scalar processor for smartphones and edge AI. | 1743 | TAMIL NADU |
| 15 | MBit Wireless Pvt. Ltd. | Dualmode LTE Cat bis and NBIoT Baseband chipset for IoT applications | 6536 | TAMIL NADU |
| 16 | Netrasemi Pvt. Ltd. | A High-End Edge-AI SoC with on-chip video analytics and vector processing computing. | 4430 | KERALA |
| 17 | Netrasemi Pvt. Ltd. | Development of ML Acceleration chip with Programmable Hardware Infrastructure for Robots, Drones, Industrial automation and Video Analytics systems (64 TOPS AI performance) on 12nm, TSMC | 6125 | KERALA |
| 18 | Green PMU Semi Pvt. Ltd. | Energy-Harvesting power management Chip for IoT applications | 986 | TELANGANA |
| 19 | WiSig Networks Pvt. Ltd. | A 5G NB-IoT based SoC for Terrestrial and Satcom Applications | 2555.57 | TELANGANA |
| 20 | MosChip Technologies Pvt. Ltd. | Smart Energy Meter IC-VIDYUT | 4000 | TELANGANA |
| 21 | Multi Nano Sense Technologies Pvt. Ltd. | MEMS Platform Gas Sensors and CMOS Data Acquisition AFE SoC | 2953 | MAHARASHTRA |
| 22 | Vervesemi Microelectronics Pvt. Ltd. | A Mixed Signal Microcontroller for Motor Control and Smart Power Applications | 2964 | UTTAR PRADESH |
| 23 | Incise Infotech Limited | A Linear LED Driver IC. | 428 | UTTAR PRADESH |
| 24 | DV2JS Innovation LLP | LowLight Image Sensor with SinglePhoton Detection for Security, Surveillance, Automobile Cameras | 748 | DELHI |
Semi-Conductor Laboratory (SCL), an autonomous body under the Ministry of Electronics and Information Technology (MeitY), Government of India, is the only Integrated Device Manufacturing Facility in the country providing end-to-end solutions for Development of Application Specific Integrated Circuits (ASICs), Opto-electronics devices, and Micro Electro Mechanical System (MEMS) Devices encompassing Design, Fabrication, Assembly, Packaging, Testing, and Reliability Assurance.
Formerly known as Semiconductor Complex Limited, a Government of India enterprise, it was converted into Semi-Conductor Laboratory under the Department of Space, Government of India, w.e.f. September 1, 2006. Administrative control of SCL, Society was transferred from the Department of Space (DoS) to the Ministry of Electronics and Information Technology (MeitY) vide notification No. 1/21/1/2022-Cab dated February 07, 2022.
SCL has an 8" wafer fab line qualified to the JEDEC-JP001A standard with a 180 nm CMOS technology node. SCL also has a 6" fab line for MEMS development and is expanding it to include a compound semiconductor fabrication facility. Process capability at SCL enables a 1.8V, 1.8/3.3V, or 1.8V/5V power-supply solution with 4-6 Al-metal layers and analog modules. The VLSI design domain in SCL spreads over analog, digital, mixed-signal, memory, RF-CMOS, and optoelectronic in the form of silicon-proven and space-qualified ASICS, ASSPs, SoCs, SCL excels in developing ceramic packages and meets the demanding test requirements at the wafer and package level, along with test plan development for high-pin-count integrated circuits, RF, and MEMS devices. At SCL, quality and reliability assurance adhere to global performance specifications such as MIL-PRF-38535, JEDEC-JP001A, and MIL-STD-883. SCL possesses capabilities in power, water, and air management, bulk, and specialty gas distribution systems. The quality parameters of Ultra Pure Water (UPW) and bulk gases produced at SCL are at par with international standards. SCL brings decades of experience to provide customers with unparalleled microelectronics solutions in India. SCL is also engaged in the fabrication of Hi-Rel boards, Radio systems, and the indigenization of electronic subsystems.
Investment Committed with India like AM, Merc, LAM, Fujifilm i.e. related to Semiconductor Investment and R&D.
Benefits associated with AEO
Benefits of MRA
Relevant to international companies setting up semiconductor manufacturing in India.
EMC 2.0 (Modified Electronics Manufacturing Clusters)
